1Layer,Alum Based, 1oz Cu,1.6mm, ENIG,Countersunk.
4Layer FR-4 2oz inner, 3oz outer layer 1.0mm + Alum Based 0.5mm Finished 1.6mm, ENTEK, Drilled on pad.
1Layer,Alum Based, 1oz Cu,1.6mm, White S/M,HASL, LED
1Layer,Alum Based, 1oz Cu,1.6mm, White S/M,HASL, LED
1Layer,Alum Based, 1oz Cu,1.6mm, White S/M, ENIG, LED
1Layer,Alum Based, 1oz Cu,1.6mm, Black S/M, ENIG, LED
1Layer,Alum Based, 1oz Cu,1.6mm, Green S/M, ENIG, High Power LED
1Layer,Alum Based, 1oz Cu,1.6mm, V-cut, ENIG, LED,Puching
This is the most effective solution to manage heat dissipation for high power LED lighting and relative electronics application.
The Metal based PCB manufactured from an Insulated Metal Substrate (IMS). Aluminum & Copper based PCB are mostly used to improve product thermal and physical performance.
Insulation Thickness: maximum 150um, minimum 75um.
Solder Resistance (288 deg. C): 120 Sec. Minimum.
Peel Strength Normal Status: Minimum 9 lb/in.
Breakdown Voltage: Minimum 4.5 kV
Dielectric Constant: 1kHz Normal status 4.9 / 1MHz Normal status 4.6
Dissipation Factor: 1kHz Normal status 0.026 / 1MHz Normal status 0.023
Water absorption: 0.05%
Thermal Conductivity (measured on insulation layer only): 2.0-3.0 W/m C deg.
Flammability : 94V0
Based Layer Types: Aluminum, Copper.
Standard types of Based Layer thickness with Copper foil thickness combination:
Single side: 2.0mm +1oz , 1.5mm+1oz, 1.5mm +2oz, 1.0mm +1oz, 0.8mm +1oz.
Double side: 2.0mm+1/1oz, 1.5mm+0.5/0.5oz, 1.5mm +1/1oz, 0.8mm+1/1oz.
4 layer stack up: FR-4 4 layer + insulation layer (thermal conductive layer) + Based Layer.
** The Base Layer thickness with copper foil can be request for any combination.
** Copper thickness: 0.5oz to 5 oz
** Aluminum material thickness: 0.8, 1.0, 1.5, 2.0, 3.2mm
** Dielectric layer thickness: 3 to 6mil
Surface Finishes: HAL, Lead Free HAL, Immersion Gold
Outline types: CNC Routing, Punching Tool.
V-score
**RoHS Compliant
