4Layer,FR-4, 1.6mm, Imepdance control.
2Layer,FR-4, 2.0mm, Blind Routing.
6Layer,FR-4, 3.0mm, 2oz Copper.
6Layer,FR-4, 1.6mm, Countersunk Plated.
16Layer,FR-4, 3.6mm, Impedance control, Min 0.35mm hole.
8Layer,FR-4, 1.6mm, HDI (1+N+1).
2Layer,FR-4, 1.0mm, Entek (OSP)
6Layer,FR-4, 1.6mm, Immersion Silver.
4Layer,FR-4, 1.0mm, (1+2+1), ENIG
4Layer,FR-4, 1.6mm, Peelable solder mask.
2Layer, FR-4, 0.8mm, ENIG.
6Layer, FR-4,1.6mm,ENIG Black S/M.
SBL (Single Build Up Laser) Technology Road Map
Class I Class II
*Material
Dielectric Layer
Thickness: 50,70+/-10um 50,70+/-10um
Material: RCC(Laser Drill Layers),FR-4
Dielectric Constant: 3.75(@1MHz)/3.20(@2GHz)
Impedance Control: +/-10% +/-7%
*Design Specification
Internal Layer
a. Conductor W/S: 100/100um 75/100um
b. Clearance Diameter: Hole Dia.+0.65mm +0.60mm
c. Land Dimeter: Hole Dia.+0.30mm +0.25mm
External Layer
d. Conductor W/S: 100/100um 75/100um
e. PTH Diameter: 0.30mm 0.25mm
f. PTH Land Diameter: Hole Dia.+0.30mm +0.25mm
PTH Distance: Land Dia.+0.15mm +0.15mm
*BVH
h. Hole Diameter: 0.30mm 0.25mm
i. Land Diameter: Hole Dia.+0.25mm +0.25mm
BVH Distance: Land Dia.+0.15mm +0.15mm
*LBH
k. Hole Diameter: -0.10mm -0.10mm
m. Land Diameter: Hole Dia.+0.25mm +0.20mm
LBH Distance: Land Dia.+0.15mm +0.15mm
Typical Specification
Class I: Volume Product Capability Class II: Advanced Product Capability
